Hardware Characterization Working Committee
Description
The PAMA Hardware Characterization Committee’s mission is to enable the transformative value of this technology by enlisting PAMA experts across industry, academia, and government to understand current limitations to PAMA hardware and how we, as a community, can overcome these barriers. The Committee also serves as a pre-competitive epicenter for open discussion regarding current and future advancements across the PAMA field to develop novel characterization instruments that can be readily implemented into industry settings.
Mission
Photopolymer AM characterization has the unique opportunity to innovate on novel characterization methods due to the complex, diverse nature of the potential applications paces. As photopolymer AM is a founding father of AM, this community has a wealth of experts with deep understanding of this technology that, until now, has yet to be tapped into sufficiently. The Committee aims to provide a conduit for researchers and industry professionals alike to learn about current characterization advancements and inform new research directions.
Current Objectives
- Identify hardware characterization parameters that are common throughout PAM and corresponding methods for characterization
- Educate PAM community on current best practices for hardware characterization and listing of specifications
- Proselytize utility of characterization techniques for implementation across the industry
- Support ongoing research efforts and collaborations in PAMA hardware characterization through concerted networking events and educational workshops
PAMA Hardware Characterization Committee
Monday, September 19th, 1:00 PM – 2:00 PM EST
Register For Meeting
The PAMA Hardware Characterization Committee’s mission is to enable the transformative value of this technology by enlisting PAMA experts across industry, academia, and government to understand current limitations to PAMA hardware and how we, as a community, can overcome these barriers.
This committee’s first meeting will serve as the beginnings of what we hope will be a pre-competitive epicenter for open discussion regarding current and future advancements across the PAMA field to develop novel characterization instruments that can be readily implemented into industry settings.
Alliance Overview and Opportunities for Photopolymer Materials and Systems Characterization
November 17-18, 2021, 1:00 PM – 3:00 PM EDT (Virtual)
Systems/Hardware Characterization Panel
This panel provides an open discussion regarding the state-of-the-art in the tools and methods to characterize PAM systems.
Committee Membership
Callie I Higgins, PhD – PAMA Founder & Ex-Officio Board Member
Chair of PAMA Hardware Characterization Committee
Dr. Callie Higgins is the Co-Project Leader of the Photopolymer Additive Manufacturing (PAM) Project at the National Institute of Standards and Technology (NIST) in Boulder, CO and is an adjunct faculty at the Colorado School of Mines. Her work with Co-Project Leader, Jason Killgore, studying the fundamental properties of PAM systems was recently the sole awardee of one of the Federal Government’s highest honors, the Samuel J. Heyman Service to America Medal (SAMMIES) for Emerging Leaders. She graduated with her PhD from CU Boulder’s Department of Electrical Engineering with specialties in optics and material science where she characterized the fundamental properties of photopatterned hydrogels for use in regenerative medicine. Outside of the lab, she loves to adventure around the mountains; skiing, hiking, and picnicking the whole way up with her husband, friends, and family.